Product Attributes
TYPE | DESCRIPTION |
---|---|
Category: | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Manufacturer: | AMD |
Series: | Zynq®-7000 |
Packaging: | Tray |
Part Status: | Active |
Architecture: | MCU, FPGA |
Core Processor: | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: | – |
RAM Size: | 256KB |
Peripherals: | DMA |
Connectivity: | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: | 667MHz |
Primary Attributes: | Artix™-7 FPGA, 28K Logic Cells |
Operating Temperature: | 0°C ~ 85°C (TJ) |
Package / Case: | 225-LFBGA, CSPBGA |
Supplier Device Package: | 225-CSPBGA (13×13) |
Number of I/O: | 86 |
Base Product Number: | XC7Z010 |
Documents & Media
Resource Type | Link |
---|---|
Datasheets: | |
Product Training Modules: | Powering Series 7 Xilinx FPGAs with TI Power Management Solutions |
Environmental Information: | |
Featured Product: | All Programmable Zynq®-7000 SoC |
PCN Design/Specification: | All product New AMD Logo 13/May/2024 |
EDA Models: | XC7Z010-1CLG225C Models |
Environmental & Export Classifications
Attribute | Description |
---|---|
RoHS Status: |
ROHS3 Compliant
|
Moisture Sensitivity Level (MSL): |
3 (168 Hours)
|
REACH Status: |
REACH Unaffected
|
ECCN: |
3A991A2
|
HTSUS: |
8542.39.0060
|
Additional Resources
Attribute | Description |
---|---|
Other Names: |
122-1855
|
Standard Package: |
160
|