DatasheetProduct Attributes
| TYPE | DESCRIPTION |
|---|---|
| Category: | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Manufacturer: | AMD |
| Series: | Zynq®-7000 |
| Packaging: | Tray |
| Part Status: | Active |
| Architecture: | MCU, FPGA |
| Core Processor: | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size: | – |
| RAM Size: | 256KB |
| Peripherals: | DMA |
| Connectivity: | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed: | 667MHz |
| Primary Attributes: | Artix™-7 FPGA, 23K Logic Cells |
| Operating Temperature: | 0°C ~ 85°C (TJ) |
| Package / Case: | 225-LFBGA, CSPBGA |
| Supplier Device Package: | 225-CSPBGA (13×13) |
| Number of I/O: | 54 |
| Base Product Number: | XC7Z007 |
Documents & Media
| Resource Type | Link |
|---|---|
| Datasheets: | |
| Environmental Information: | |
| Featured Product: | |
| PCN Design/Specification: | All product New AMD Logo 13/May/2024 |
| EDA Models: | XC7Z007S-1CLG225C Models |
Environmental & Export Classifications
| Attribute | Description |
|---|---|
| RoHS Status: |
ROHS3 Compliant
|
| Moisture Sensitivity Level (MSL): |
3 (168 Hours)
|
| REACH Status: |
REACH Unaffected
|
| ECCN: |
3A991D
|
| HTSUS: |
8542.39.0060
|
Additional Resources
| Attribute | Description |
|---|---|
| Other Names: |
122-2002
|
| Standard Package: |
160
|
